| PART |
Description |
Maker |
| BM-20EG57MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| SIDC02D60SIC2SAWN SIDC02D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 6A die sawn
Diodes - HV Chips - 600V, 6A die unsawn
|
Infineon
|
| 1206GA150JAT1A 1808AA105JA11A 1808GC223JA11A 1808H |
CAP 15PF 2000V 5% NP0(C0G) SMD-1206 TR-7 PLATED-NI/SN CAPACITOR, CERAMIC, MULTILAYER, 2000 V, C0G, 0.000015 uF, SURFACE MOUNT, 1206
High Voltage MLC Chips For 600V to 5000V Application
High Voltage MLC Chips For 600V to 5000V Application
|
AVX, Corp.
AVX Corporation
|
| 2KG023075JL |
SWITCHING DIODE CHIPS
|
Silan Microelectronics Joint-stock
|
| CD5532B CD5546B CD5519B CD5521B CD5518B CD5533B CD |
ZENER DIODE CHIPS
|
CDI-DIODE[Compensated Deuices Incorporated]
|
| 2CW032XXXJL-R |
ZENER DIODE CHIPS
|
Silan Microelectronics
|
| SB320-1.5 SB340-1.5 |
Chips for Schottky Diodes
|
Gunter Seniconductor GmbH.
|
| 2KG034350JL |
SWITCHING DIODE CHIPS
|
Silan Microelectronics Joint-stock
|
| MBR5045 |
Chips for Schottky Diodes
|
Gunter Seniconductor GmbH.
|
| KKD1520 |
CMOS LSI chips
|
KODENSHI KOREA CORP.
|
